〇 Nano-level mechanical positioning accuracy
〇 High temperature stability, stability ≤±0.2℃
〇 Rapid algorithm optimization minimizes idle waiting time
〇 Loading and unloading supports blue tape or chip adsorption box for various forms
〇 Integrated pure optical test/pure electric test/photoelectric hybrid test/RF test
〇 Automatic calibration, real-time fault diagnosis, and predictive maintenance
〇 Fully automated chip testing workflow with intelligent data analysis
〇 Automated chip handling system for fast pickup, positioning, testing, and sorting
〇 Supports single/4/8-channel coupled chip testing with high alignment precision
〇 Parallel testing technology enhances throughput and reduces per-unit cost