Fully Automated Wafer Defect Inspection System
WI-6500AL

WI-6500AL Fully Automated Wafer Defect Inspection System integrates an automated loading/unloading system, vision inspection system, and control software to perform automatic defect inspection for up to 25 wafers per batch. It detects wafer quantity and position in cassettes, rapidly locates defects, captures defect images, classifies defect types, and stores results in the production line database. Designed for both in-line and post-process stages, it enables operators and engineers to swiftly analyze overall process performance. Compared to manual inspection, the system demonstrates superior precision, efficiency, accuracy, and stability, significantly reducing false and missed detection rates.


Product Features

〇    Minimum detectable defect size: 0.5μm (supports bright/dark field observation)

〇    Wafer size: 2–12 inches (customizable, including blue film support)

〇    Automated batch testing: 25pcs per batch

〇    Auto-focus and multi-layer image capture

〇    Machine vision-based defect detection

〇    Defect analysis and map report generatio

Product Application

The system supports defect inspection for Silicon, SiC, GaAs, GaN, InP, and other materials, detecting contamination, waveguide fractures, scratches, color anomalies, pin mark deviations, silicon cracks, edge chipping, and more, for both patterned and unpatterned wafers.

Technical Specifications

Vision Inspection System

Bright/Dark Field

√

DIC (Differential Interference Contrast)

√

Imaging Type

Color/Monochrome

Magnification

1.25X/2.5X/5X/10X/20X/50X (etc.)

Lens Auto-Switching

√

Defect Detection

Automated

Defect Types

Contamination, waveguide fractures, scratches, color anomalies, pin mark deviations, silicon 

cracks, edge chipping, etc.

Defect Classification

√

Defect Detection Error Rate

0.1%

Minimum Detection Resolution

0.5μm

Deep Learning Module

√

Nitrogen Purge Function

√

Chuck Platform

Compatible Wafer Sizes

Compatible Wafer Sizes: 2~12 inches (customizable); supports blue film, chip adsorption boxes, 

and other formats

Auto-Focus

√

XYZ&Rotary Stage

√

Automated Loading

Cassette Capacity

1~2 cassettes

Pre-Calibration

√

Wafer-ID Recognition

√

Operating Environment

Cleanliness Class

Class1K/10K

Ambient Temperature

25℃±3℃

Ambient Humidity

55~65%RH

Software

Permission Management

Engineer/operator role-based access control

Golden Sample Creation

Guided interface for rapid reference sample setup

Open Interfaces

Supports custom image algorithm development via DLL or communication protocols for 

defect detection control

Language Support

Language Support: English, Simplified Chinese, Traditional Chinese

Image Stitching

Full-chip image stitching at specified magnifications with ID-based naming

Wafer Map

Auto/manual map generation with dynamic defect status display during testing

Zoned Inspection

Defect criteria customization for distinct regions


Product Features

Product Application

Technical Specifications

Questions?

Eternal team is at your service!

Tel: (+86) 027-87001679

Email: sales@eternal-technologies.com