Fully Automated Photonics Wafer Test System
WIT-220AL

WIT-220AL Fully Automated Photonics Wafer Test System, designed with considerations for stability, electrical noise mitigation, and spatial configuration, incorporates a precision motion control system and a high-performance vibration isolation system. Integrated with proprietary image processing algorithms, it enables highly stable optical characterization of small-mode-field chips and high-accuracy electrical performance measurements. The system supports fully automated wafer-level testing via grating coupling or end-face coupling, meeting stringent optical testing specifications and pA-level electrical signal measurement requirements. By facilitating early-stage defective chip screening at the wafer level, it prevents downstream process contamination, significantly reducing overall packaging and testing costs while enhancing production efficiency. The system has been deployed in mass production lines across domestic and international client facilities.

Product Features

〇    Fully automatic calibration by machine vision

〇    Automatic crimping of probes/probe cards

〇    Rapid auto-light alignment

〇    Wafer size: 2–12 inch (customizable)

〇    GC/EC testing for arbitrary small-mode-spot chips

〇    Automated loading/unloading and defect detection

〇    Optional end-to-end testing solutions

〇    Temperature range: -40℃~125℃ (wider range customizable)


Product Application

The system is mainly designed for the fields of silicon photonics, thin-film lithium niobate(TFLN), III-V semiconductors, etc. It supports the testing of cutting-edge technologies such as Optical-Optical (OO) coupling and Optical-Electrical (OE) conversion. For optical testing, it is compatible with Single-Mode Fiber (SMF), Lensed Fiber, Ferrule Assembly (FA), etc.; For electrical testing, it is compatible with probe stations or probe cards, meeting the testing requirements of various application scenarios in both R&D and mass production.

Technical Specifications

Basic Parameters

Wafer Size

2~12 inch (customizable), zoned design

Loading Method

Automatic

Loading Type

Cassette/FOUP

Testing Capacity

25~50 pcs/run

Wafer-ID

OCR-based automatic Wafer-ID recognition with Wafer Map generation

Auxiliary Chuck

Enables automatic probe cleaning, RF calibration, FA calibration, PD power/polarization calibration

Single-Probe Marking

√

Self-Cleaning

√ (for wafer, Chuck, probes, FA)

Real-Time Height Sensing

√

Chuck Height Calibration

√

Chuck Positioning Accuracy

±2µm

Temperature Range

-40℃~125℃ (customizable wider ranges available)

Optical Parameters

Fiber type

SMF / Lens Fiber / FA

Coupling Repeatability

≤0.3dB (typ.)

Coupling Stability

0.3dB/5min (typ.)

Coupling Efficiency

≤5s

Coupling Modes

Spiral/Cross/Matrix/Fast 3D Coupling

Incident Angle Scanning

√

Sensor Collision Avoidance

√

Electrical Specifications

Integrated Probe Count

Customizable

Power Type

DC/RF

Power Delivery

Probe/Probe Card

Probe Type

Cantilever/Vertical Probe

Cleaning Mode

Automatic

Electrical Specifications

User Permissions

Role-based access control for R&D/production

Script Execution

Supports user-defined test algorithms via Python or other languages

Internationalization

English/Simplified Chinese/Traditional Chinese

Data Storage

MES integration & database storage

GUI Interface

Real-time process monitoring & historical data traceabilit


Product Features

Product Application

Technical Specifications

Questions?

Eternal team is at your service!

Tel: (+86) 027-87001679

Email: sales@eternal-technologies.com