Automated FA Coupling and Packaging System
CA-1000

Automated FA Coupling and Packaging System balances R&D flexibility with mass production efficiency, offering customizable semi-automatic and fully automatic coupling solutions based on manual coupling systems.The system supports single-mode fiber (SMF), polarization-maintaining (PM) fiber, and fiber array coupling scenarios, achieving automated glue dipping, dispensing, and curing processes.


Product Features

〇    Supports silicon light, thin film lithium niobate, III-V and other fields

〇    Coupling repeatability <0.3dB

〇    Manual/semi-automatic/fully automatic operation modes

〇    Cost-effective rapid upgrade iterations

〇    Automated dispensing with UV/thermal curing

〇    High-precision motion stage system 

〇    LEGO-style modular design for customized solutions

〇    Auto-calibration system: UV adhesive volume, UV energy, camera positions, nozzles, grippers

〇    Integrated vision recognition, height measurement, force/position sensing

〇    Fiber coupling, FA coupling, and chip inter-coupling scenarios


Product Application

The system targets packaging processes for silicon photonics, thin-film lithium niobate, and III-V compound devices. Designed for both mass production applications and customized R&D coupling requirements, it ensures optimized process paths and high coupling efficiency. The system supports single-mode fiber (SMF), polarization-maintaining (PM) fiber, and fiber array coupling scenarios, enabling fully automated material handling, automatic glue dipping/dispensing, and adhesive curing. Customizable modules, including laser welding compatibility, can be integrated.

Technical Specifications

Coupling Axis Control Precision

Travel Range (X/Y/Z)

100mm/100mm/30mm

Minimum Resolution

5nm (high-precision model), 100nm (standard)

Minimum Motion Increment

50nm

Repeatability Positioning Accuracy

±50nm

Unidirectional Positioning Accuracy (closed-loop)

±0.5μm

Rotation Axes (θx/θy/θz)

±6°/±5°/±6°

Rotation Axis Resolution (θx/θy/θz)

0.003°/0.002°/0.002°

Optical Coupling Performance

FA-PIC Gap Control

±2μm

Coupling Efficiency

>90% (typical), supports multi-channel parallel coupling

Automation & Production Efficiency

Dual-FA Synchronous Coupling:

4~5 minutes/dual FA, 50% faster than traditional single-channel systems

Dispensing

Glue volume accuracy ±1%, supports nanoscale gap filling

Ultra-Precision Motion Control

Vibration Resistance Class

VC-C

Force Feedback Technology

Pressure sensor detects FA-chip contact force <10g to prevent device damage

Machine Learning

Optimizes coupling paths based on historical data, improving yield by 10~15%

Multi-Scenario Compatibility

Supported Module Types

QSFP-DD/QSFP/OSFP/CPO/BOX, compatible with PM FA and MDF (Mode Field 

Diameter Conversion) FA

Multi-Process Integration

Laser welding (e.g., BOX laser pigtail coupling) and glue curing, supports hybrid 

packaging

Software

Permission Management

Role-based access control for R&D/production

Process Flow Sequencing

Customizable automated packaging workflows for rapid product switching

High-Speed Image Processing & Algorithms

Real-time FA position tracking with nozzle alignment

Coupling Algorithms

Supports angle coupling, spiral coupling, hill-climbing algorithms

Language Support

English, Simplified Chinese, Traditional Chinese

Data Storage

MES system integration, database storage

GUI

Real-time process parameter monitoring and historical data traceability


Product Features

Product Application

Technical Specifications

Questions?

Eternal team is at your service!

Tel: (+86) 027-87001679

Email: sales@eternal-technologies.com