COC Reliability and Burn-in System
LHX-306-COC

The LHX-306-COC is an automated burn-in and reliability test system for semiconductor laser chips mounted on carrier (COC). It is built for volume production screening and qualification. The system combines high channel density drive electronics, independent temperature control per channel, real-time optical power monitoring and centralised test data management. It supports batch burn-in of DFB, DML, EML and VCSEL devices.


Product Features
  • Ultra-high channel density: a single system supports up to 4224 channels of 4-quadrant source measurement units for simultaneous aging. The entire system integrates multi-layer aging units, with multiple independent drawers on each layer, providing high-density parallel aging capability to meet the needs of large-scale simultaneous testing;

  • Independent and precise temperature control: Each fixture is equipped with independent heating, temperature control, monitoring, overtemperature protection, and cooling units, enabling energy-saving temperature control in different zones and avoiding energy waste as well as temperature unevenness in overall temperature control;

  • High-precision drive power supply: Equipped with ACC (automatic current control) mode, it maintains a constant aging current when contact resistance varies, ensuring accurate and reliable testing;

  • Dual Safety Protection: The driver board employs a coordinated mechanism of hardware protection and software control to eliminate risks such as EOS, overcurrent, and overvoltage at the source. If communication is lost, the aging process automatically pauses for a set period of time; after an abnormal stoppage, the aging process can resume, enabling round-the-clock continuous operation;

  • Real-time monitoring and intelligent analysis: Supports external PD current acquisition, possesses Ith threshold analysis capability, with test repeatability better than ±1%. All data are automatically saved to a database, enabling historical traceability, quick queries, and integration with MES systems;

  • After aging is completed, the fishbone fixture can be placed directly on the test station for further testing and analysis , such as threshold current, spectrum, and other parameters.


Product Application
  • Mass Production Aging Line for Optical Communication Chips : Suitable for high-volume aging testing and early failure screening of COC chips for lasers such as DFB, DML, EML, and VCSEL. Features multi-channel parallel aging capability within a single system to meet the production ramp-up demands of high-speed optical modules, and is compatible with fishbone fixtures for rapid changeovers; 

  • LiDAR and Automotive Optoelectronics: Four-quadrant driver sources are compatible with various driving requirements of LiDAR chips;

  • Data center and 5G infrastructure: Integrates with MES systems to enable end-to-end traceability of aging data and quality control, ensuring high reliability for high-speed optical modules; 

  • Research and Development (R&D) and Pilot production: Flexible software configuration supports diverse aging scenarios during new product introduction phases.


Technical Specifications
Basic Parameters

Number of layers (fully configured)

11 layers

Data Storage

Automatically save the raw test data, calculation results, and detailed logs of system operation

Database

SQL

Communication fault protection

After communication disconnection, the aging process will automatically stop after 15 minutes, and it supports resuming the aging process after an abnormal stop

Maximum device capacity*1

4224 COC chips

Heating / cooling method

 Heating plate + air cooling

Heat sink temperature range *2

40℃~120℃

Heat sink ramp rate (heating / cooling)

Heating: >6°C/min, Cooling: >5°C/min

Heat sink temperature setting accuracy/resolution

0.1℃

Heat sink temperature uniformity (no load)

±1℃(40℃~100℃),±1.5℃(100℃~120℃)

Heat sink temperature stability (no load)

±0.5℃

Temperature stability over 24 hours

±0.5℃

Heat sink over-temperature detection

supported

Over-temperature protection

Hardware protection temperature >150℃

Drive source type

Four-quadrant

Drive current range/accuracy/stability

±1000mA;0.3% F.S.±0.07mA;0.1% F.S.±0.07mA

Current measurement resolution

0.13mA

Drive voltage range/accuracy/stability

±7.5V;0.3%F.S.±1.25mV;0.15%F.S.±1.25mV

Voltage measurement resolution/accuracy

1.25mV;±50mV

External photodiode (PD) measurement range/accuracy/resolution/stability

0-6mA;±30μA;0.1μA;±3μA

EOS

Under working conditions, without EOS

Drive current and voltage clamping

Configurable


Product Features

Product Application

Technical Specifications

Questions?

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Tel: (+86) 027-87001679

Email: sales@eternal-technologies.com

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