| Basic Parameters |
Number of layers (fully configured) | 11 layers |
Data Storage | Automatically save the raw test data, calculation results, and detailed logs of system operation |
Database | SQL |
Communication fault protection | After communication disconnection, the aging process will automatically stop after 15 minutes, and it supports resuming the aging process after an abnormal stop |
Maximum device capacity*1 | 4224 COC chips |
Heating / cooling method | Heating plate + air cooling |
Heat sink temperature range *2 | 40℃~120℃ |
Heat sink ramp rate (heating / cooling) | Heating: >6°C/min, Cooling: >5°C/min |
Heat sink temperature setting accuracy/resolution | 0.1℃ |
Heat sink temperature uniformity (no load) | ±1℃(40℃~100℃),±1.5℃(100℃~120℃) |
Heat sink temperature stability (no load) | ±0.5℃ |
Temperature stability over 24 hours | ±0.5℃ |
Heat sink over-temperature detection | supported |
Over-temperature protection | Hardware protection temperature >150℃ |
Drive source type | Four-quadrant |
Drive current range/accuracy/stability | ±1000mA;0.3% F.S.±0.07mA;0.1% F.S.±0.07mA |
Current measurement resolution | 0.13mA |
Drive voltage range/accuracy/stability | ±7.5V;0.3%F.S.±1.25mV;0.15%F.S.±1.25mV |
Voltage measurement resolution/accuracy | 1.25mV;±50mV |
External photodiode (PD) measurement range/accuracy/resolution/stability | 0-6mA;±30μA;0.1μA;±3μA |
EOS | Under working conditions, without EOS |
Drive current and voltage clamping | Configurable |